Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes

ABSTRACT

An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.

FIELD OF THE DISCLOSURE

This disclosure generally relates to encapsulant compounds, and moreparticularly relates to providing metal coiled and rigid conduit insertsfor encapsulant compound formulation kneading and encapsulation back-endassembly processes.

BACKGROUND

Encapsulation in electronic device manufacturing is the process ofcovering the components of an electronic device or assembly with anencapsulant compound to protect the components from mechanical shock andvibration, corrosion, and contamination form dust, moisture, chemicals,or other contaminants. Encapsulation can also be performed to providefor a tamper resistant and tamper evident electronic device or assembly.Encapsulation can be performed on an open electronic device or assemblyusing a dam and fill operation where a barrier dam is placed around thecomponents to be encapsulated and pouring the encapsulant compound ontothe components within the barrier dam, or by use of an injection moldingprocess that injects the encapsulant compound into a mold cavity thatsurrounds the components to be encapsulated. Encapsulation can also beperformed on a closed electronic device or assembly by injecting theencapsulant compound into a cap or cover for the electronic device orassembly and then assembling the cap or cover onto the electronic deviceor assembly. In generally, encapsulation provides greater protection toan electronic device or assembly than can be achieved with a conformalcoating process. Encapsulant compounds are typically provided fromcompound manufacturers in a pelletized form, and electronicsmanufacturers then melt the encapsulant compound pellets for use in theencapsulation process. Foreign material and contamination in theencapsulant compounds are a persistent problem for electronicsmanufacturers. It will therefore be understood that better processes forthe removal of such foreign material and contaminants from encapsulantcompounds is desirable for the improved reliability of encapsulatedelectronic devices and assemblies.

SUMMARY

In a first embodiment, an encapsulant compound apparatus may include amechanical operator; and a first insert disposed on a surface of themechanical operator. The first insert may operate to capture foreignmaterial in the encapsulant compound.

In a particular case, the first insert may be a coil magnet placedwithin a hole in the surface of the mechanical operator. In anothercase, the first insert may be a rigid magnet pressed into a hole in thesurface of the mechanical operator. In yet another case, the insertfirst may be fabricated of one of zinc, stainless steel, a titaniumalloy, and a composite plastic. In still another case, the first insertmay be replaceable. In a further case, the mechanical operator mayfurther include a second insert disposed on the surface of themechanical operator.

In another particular case, the mechanical operator may be characterizedas a kneader including a rotator shaft and a kneader cam installed ontothe rotator shaft. The kneader cam may include the first insert disposedon a kneading surface of the kneading cam, wherein, when the rotatorshaft is rotated, the kneader cam may operate to knead the encapsulantcompound and the insert may operate to capture foreign material in theencapsulant compound.

In another particular case, the mechanical operator may be characterizedas a pellet vibrator for cleaning encapsulant compound pellets. Thepellet vibrator may include a pellet buffer bowl including the firstinsert disposed on a surface of the pellet buffer bowl, wherein, whenthe pellet buffer bowl is vibrated, the first insert may operate tocapture foreign material mixed with the encapsulant compound pellets.

In another particular case, the mechanical operator may be characterizedas an encapsulant extruder for extruding the encapsulant compound ontoan electronic device. The encapsulant extruder may include a reservoirfor melting encapsulant compound pellets, a plunger for extruding themelted encapsulant compound onto the electronic device, and a moldrunner for channeling the melted encapsulant compound from the reservoirto the electronic device. The first insert may be characterized as adisk placed upon the plunger to capture the foreign material mixed withthe melted encapsulant compound.

In another particular case, the mechanical operator may be characterizedas an encapsulant extruder for extruding encapsulant compound onto anelectronic device. The encapsulant extruder may include a reservoir formelting encapsulant compound pellets, a plunger for extruding the meltedencapsulant compound onto the electronic device, ands a mold runner forchanneling the melted encapsulant compound from the reservoir to theelectronic device. The first insert may be characterized as a filterplaced atop the encapsulant compound pellets. The melted encapsulantcompound may be filtered through the filter before being extrudedthrough the mold runner to capture foreign material mixed with themelted encapsulant compound.

In another embodiment, a method may include processing encapsulantcompound with a mechanical operator, and disposing a first insert on asurface of the mechanical operator. The first insert may operate tocapture foreign material in the encapsulant compound.

In a particular case, the first insert may be a coil magnet placedwithin a hole in the surface of the mechanical operator. In anothercase, the first insert may be a rigid magnet pressed into a hole in thesurface of the mechanical operator. In yet another case, the insertfirst may be fabricated of one of zinc, stainless steel, a titaniumalloy, and a composite plastic. In still another case, the first insertmay be replaceable. In a further case, the mechanical operator mayfurther include a second insert disposed on the surface of themechanical operator.

In another particular case, the mechanical operator may be characterizedas a kneader including a rotator shaft and a kneader cam installed ontothe rotator shaft. The method may further include installing a kneadercam on a rotator shaft, the kneader cam including the first insertdisposed on a kneading surface of the kneading cam, and rotating therotator shaft to operate the kneader cam to knead the encapsulantcompound. When the rotator shaft is rotated, the first insert mayoperate to capture foreign material in the encapsulant compound.

In another particular case, the mechanical operator may be characterizedas a pellet vibrator for cleaning encapsulant compound pellets. Themethod may further include processing the encapsulant compound pelletsin a pellet buffer bowl of the pellet vibrator, the pellet buffer bowlincluding the first insert disposed on a surface of the pellet bufferbowl, and vibrating the pellet buffer bowl. When the pellet buffer bowlis vibrated, the first insert may operate to capture foreign materialmixed with the encapsulant compound pellets.

In another particular case, the mechanical operator may be characterizedas an encapsulant extruder for extruding the encapsulant compound ontoan electronic device. The method may further include placing the firstinsert into a reservoir of the encapsulant extruder, placing encapsulantcompound pellets into the reservoir of the encapsulant extruder atop thefirst insert, melting the encapsulant compound pellets, and extrudingthe melted encapsulant compound onto the electronic device.

In another particular case, the mechanical operator may be characterizedas an encapsulant extruder for extruding the encapsulant compound ontoan electronic device. The method may further include placing encapsulantcompound pellets into a reservoir of the encapsulant extruder, placingthe first insert atop the encapsulant compound pellets, melting theencapsulant compound pellets, and extruding the melted encapsulantcompound onto the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

It will be appreciated that for simplicity and clarity of illustration,elements illustrated in the Figures have not necessarily been drawn toscale. For example, the dimensions of some of the elements areexaggerated relative to other elements. Embodiments incorporatingteachings of the present disclosure are shown and described with respectto the drawings presented herein, in which:

FIG. 1 illustrates a high-level process flow for the manufacture and useof pelletized encapsulant compounds according to an embodiment of thecurrent disclosure;

FIG. 2 is a block diagram of a pellet manufacturing process according toan embodiment of the current disclosure;

FIG. 3 is a diagram of a pellet handling process according to anembodiment of the current disclosure; and

FIGS. 4-6 are diagrams of encapsulant extruders according to variousembodiments of the current disclosure.

The use of the same reference symbols in different drawings indicatessimilar or identical items.

DETAILED DESCRIPTION OF DRAWINGS

The following description in combination with the Figures is provided toassist in understanding the teachings disclosed herein. The followingdiscussion will focus on specific implementations and embodiments of theteachings. This focus is provided to assist in describing the teachings,and should not be interpreted as a limitation on the scope orapplicability of the teachings. However, other teachings can certainlybe used in this application. The teachings can also be used in otherapplications, as needed or desired.

FIG. 1 . illustrates a high-level process flow 100 for the manufactureand use of pelletized encapsulant compounds. In a first step 110,encapsulant compound pellets (hereinafter referred to as “pellets”) aremanufactured by a compound manufacturer. In a second step 120, thepellets are handled prior to use in the assembly of electronic devicesand assemblies. The handling of the pellets, as described herein, may beunderstood to be at the site of manufacture of the pellets after step110, or to be at the site of the use of the pellets in encapsulating theelectronic devices or assemblies before step 130. In a third step 130,the pellets are melted and extruded into a mold to encapsulate theelectronic devices or assemblies. Encapsulant compounds may includeepoxy mold compounds (EMCs), silicon compounds, urethane compounds,acrylic compounds, or other compounds. The details of encapsulantcompounds and encapsulant compound pellets, of pellet handling, and ofpellet molding, are known in the art, and will not be further describedherein, except as needed to illustrate the current embodiments.

FIG. 2 illustrates the pellet manufacturing process 110 from FIG. 1 .Here, a typical manufacturing process of pellets includes a compoundkneading operation performed in a kneader. The kneader includes a seriesof parallel rotating shafts (not illustrated), upon which are affixed anumber of kneaders. The kneaders are oblong shaped and are affixed tothe rotating shafts to provide a mixing and kneading action for thecompound. A typical shaft may include one or more kneader, and eachadjacent shaft may rotate in an opposite direction, such that thekneaders on the adjacent shafts provide an alternating compression andexpansion of the compound, thereby mixing and kneading the compound. Thekneaders are fabricated with magnetic inserts in the face of thekneaders that entrap magnetic particles contained in the compound.

In a first embodiment, pellet manufacturing process 110-A includes acompound kneader 200 with one or more kneader cam 210 disposed on ashaft 205. Kneader cam 210 includes one or more magnetic insert 212installed on the kneading surface of the kneader cam. Magnetic inserts212 are magnetic coil inserts that are placed within matching holes inthe surface of kneader cam 210. In a second embodiment, pelletmanufacturing process 110-B includes a compound kneader 220 with one ormore kneader cam 230 disposed on a shaft 225. Kneader cam 230 includesone or more magnetic insert 232 installed on the kneading surface of thekneader cam. Magnetic inserts 232 are rigid magnets that are pressedinto the matching holes in the surface of kneader cam 230. In eitherembodiment, as the kneader cams rotate within the compound, magneticforeign material is attracted to and retained by the magnetic inserts.After a batch of compound is kneaded, the compound kneader is cleaned.Here, the cleaning includes removing the trapped magnetic foreignmaterial from the magnetic inserts. The use of kneader cams withmagnetized inserts provides for the fabrication of compound pellets thatdo not include magnetic foreign material.

The magnetic inserts may be fabricated of a corrosion resistant magneticmaterial, such as zinc, stainless steel, a titanium alloy, a compositeplastic, or another magnetic material, as needed or desired. It will beunderstood that, with use, the strength of the magnetic inserts willdiminish such that, over time, the amount of magnetic foreign materialthat is retained by the magnetic inserts may decrease. In a particularembodiment, the magnetic inserts are replaceable. In another embodiment,the magnetic inserts are not replaceable, but the kneader cams arereplaceable. In this way, a compound kneader as is known in the art canbe modified to improve the quality of the compound pellets produced byreplacing kneader cams that do not include magnetic inserts with newkneader cams with magnetic inserts, without having to replace the entirecompound kneader.

In another embodiment, not illustrated, a compound kneader may includeone or more counter-rotating screws that operate to mix and knead theencapsulant compound, and to also maintain a flow of the compoundthrough the compound kneader for a continuous flow process. Here, thecounter-rotating screws will be understood to include one or moremagnetic insert within the screw face of the screws to entrap magneticforeign material. Subsequent to the kneading as performed by thecompound kneaders in the above-described embodiments, the pelletmanufacturing process will include forming the compound batch intopellets. Further details of compound kneading and compound pelletizationare known in the art, and will not be further described herein, exceptas needed to illustrate the current embodiments.

FIG. 3 illustrates the pellet handling process 120 from FIG. 1 . Here, atypical pellet handling process includes a pellet hopper 300, a pelletconveyor 310, a dust vacuum 320, and a pellet buffer/vibrator bowl 330.Pellets are stored in pellet hopper 300 until needed and are thenreleased onto pellet conveyor 310. Pellet conveyor 210 transfers thepellets to pellet buffer/vibrator bowl 330. Pellet conveyor 310 isconfigured to permit an air flow created by dust vacuum 320 that drawsdust and fine fibers from out of the stream of pellets, thereby reducingthe amount of foreign material that enters pellet buffer/vibrator bowl330. However, it will be further understood that, in some cases, pelletconveyor 310 may be understood to still transfer foreign material topellet buffer/vibrator bowl 330, depending on the cleanliness of theenvironment. Pellet buffer/vibrator bowl 330 operates to further shakeforeign material from the accumulated pellets.

In a particular embodiment, pellet buffer/vibrator bowl 330 includes oneor more magnetic insert 332 installed in the side and bottom of thepellet buffer/vibrator bowl. Here, magnetic inserts 332 are magneticcoil inserts that are placed within matching holes in the side andbottom surfaces of pellet buffer/vibrator bowl 330. In a secondembodiment, pellet buffer/vibrator bowl 330 includes one or moremagnetic insert 334 installed in the side and bottom of the pelletbuffer/vibrator bowl. Here, magnetic inserts 334 are rigid magnets thatare pressed into matching holes in the side and bottom of pelletbuffer/vibrator bowl 330. As the stream of pellets from pellet conveyor310 enter pellet buffer/vibrator bowl 330, magnetic foreign material isattracted to and retained by the magnetic inserts. After a batch ofpellets are handled by handling process 120, pellet buffer/vibrator bowlis cleaned. Here, the cleaning includes removing the trapped magneticforeign material from the magnetic inserts. The use of pelletbuffer/vibrator bowls with magnetized inserts provides for the furtherreduction in the amount of magnetic foreign material from the pelletsused in pellet mold extrusion. Subsequent to the pellet handlingprocess, the pellets are transferred to pellet mold extrusion process130, as described below. Further details of pellet handling processesare known in the art and will not be further described herein except asneeded to illustrate the current embodiments.

FIGS. 4-6 illustrate various embodiments of pellet mold extrusionprocess 130. In FIG. 4 , an extruder 400 includes a pellet reservoir,sometimes referred to as a plunger wall, with a plunger 410 within thereservoir. Plunger 410 is drawn to the bottom of the reservoir, andpellets are placed into the reservoir. Extruder 400 is energized to heatthe pellets to a viscous liquid pellet melt 420. For example, extruder400 can heat the pellets to 175° C., or another temperature, as neededor desired to melt the pellets to the desired consistency. When thepellets are melted, plunger 420 is forced into the reservoir, extrudingpellet melt 420 through compound runner 430 and into package cavity die440 to encapsulate the electronic device or assembly within the packagecavity die. The pellet melt is permitted to cool, and the encapsulatedelectronic device or assembly is removed from pellet mold extrusionprocess 130 for further processing as needed or desired.

Extruder 400 includes one or more magnetic insert 404 installed withincavities 402 within the sides of the reservoir or compound runner 430.Magnetic inserts 404 may represent coil magnets that are placed withincavities 402 of extruder 400, or may represent rigid magnets that arepressed into the cavities of the extruder. As pellet melt 420 isextruded from the reservoir and through compound runner 430, magneticforeign material is attracted to and retained by the magnetic inserts.After a batch of pellet melt 420 is extruded to encapsulate theelectronic devices or assemblies, extruder 400 is cleaned. Here, thecleaning includes removing the trapped magnetic foreign material fromthe magnetic inserts. The use of magnetic inserts 402 in the reservoirand compound runner 430 provides for the further reduction in the amountof magnetic foreign material in the final encapsulated electronic deviceor assembly.

FIG. 5 illustrates another embodiment of pellet mold extrusion process130 similar to the embodiment described in FIG. 4 . Here, an extruder500 includes a reservoir with a plunger 510 within the reservoir.Plunger 510 is drawn to the bottom of the reservoir, and a magnetic disk550 is placed atop the plunger before pellets are placed into thereservoir. Extruder 500 is energized to heat the pellets to a viscousliquid pellet melt 520. For example, extruder 500 can heat the pelletsto 175° C., or another temperature, as needed or desired to melt thepellets to the desired consistency. When the pellets are melted, plunger520 is forced into the reservoir, extruding pellet melt 520 throughcompound runner 530 and into package cavity die 540 to encapsulate theelectronic device or assembly within the package cavity die. The pelletmelt is permitted to cool, and the encapsulated electronic device orassembly is removed from pellet mold extrusion process 130 for furtherprocessing as needed or desired. Here, the inclusion of magnetic disk550 causes magnetic foreign material to be attracted to the bottom ofpellet melt 520, rather than to be extruded into the encapsulatedelectronic device or assembly. After a batch of pellet melt 520 isextruded to encapsulate the electronic devices or assemblies, extruder500 is cleaned. Here, the cleaning includes removing the trappedmagnetic foreign material from magnetic disk 550. The use of magneticdisk 550 in the bottom of the reservoir provides for the furtherreduction in the amount of magnetic foreign material in the finalencapsulated electronic device or assembly.

FIG. 6 illustrates another embodiment of pellet mold extrusion process130 as described with respect to FIG. 5 . Here, rather than placingmagnetic disk 550 into the reservoir prior to the addition of thepellets, the pellets are first placed into the reservoir, and a magneticfilter 640 is placed atop the pellets. Then, when the pellets are meltedand pellet melt 520 is forced through magnetic filter 640, throughcompound runner 530 and into package cavity die 540 to encapsulate theelectronic device or assembly. In this way, not only is magnetic foreignmaterial captured in magnetic filter 640, but other foreign material iscaptured as well. An example of a magnetic filter may include amagnetized sintered filter, a cloth or paper filter materialincorporated with a magnetic mesh, or another type of magnetic filter,as needed or desired. Note that, with either the embodiment of FIG. 5 ,or the embodiment of FIG. 6 , existing mold extrusion process equipmentmay be utilized without modification, and only the magnetic disk 550 orthe magnetic filter 640 need be added to the process to improve theretention of magnetic foreign material, and improve the reliability ofthe electronic devices or assemblies.

In a particular embodiment, one or more of magnetic inserts, a magneticdisk, or a magnetic filter may be surface treated to ensure that silicaparticles in the mold compound do not get trapped. For example, themagnetic inserts, the magnetic disk, or the magnetic filter may betreated to create an opposite charge to the silica filler in the moldcompound, thereby causing the silica filter to be repelled from themagnetic inserts, the magnetic disk, or the magnetic filter, as neededor desired. In another particular embodiment, where a magnetic insert, amagnetic disk, or a magnetic filter are fabricated of zinc or otherwisefabricated of a material that includes zinc, chlorine ions within theencapsulant compound will be attracted to the zinc, thereby removing acorrosive agent from the encapsulant compound. In another particularembodiment, particularly where a magnetic insert is a coil magnet,further operates to trap foreign material within the coils.

Although only a few exemplary embodiments have been described in detailherein, those skilled in the art will readily appreciate that manymodifications are possible in the exemplary embodiments withoutmaterially departing from the novel teachings and advantages of theembodiments of the present disclosure. Accordingly, all suchmodifications are intended to be included within the scope of theembodiments of the present disclosure as defined in the followingclaims. In the claims, means-plus-function clauses are intended to coverthe structures described herein as performing the recited function andnot only structural equivalents, but also equivalent structures.

The above-disclosed subject matter is to be considered illustrative, andnot restrictive, and the appended claims are intended to cover any andall such modifications, enhancements, and other embodiments that fallwithin the scope of the present invention. Thus, to the maximum extentallowed by law, the scope of the present invention is to be determinedby the broadest permissible interpretation of the following claims andtheir equivalents, and shall not be restricted or limited by theforegoing detailed description.

What is claimed is: 1-10. (canceled)
 11. A method of processingencapsulant compound, the method comprising: processing encapsulantcompound with a mechanical operator; and disposing a first insert on asurface of the mechanical operator, wherein the first insert operates tocapture foreign material in the encapsulant compound.
 12. The method ofclaim 11, wherein the first insert is a coil magnet placed within a holein the surface of the mechanical operator.
 13. The method of claim 11,wherein the first insert is a rigid magnet pressed into a hole in thesurface of the mechanical operator.
 14. The method of claim 11, whereinthe insert first is fabricated of one of zinc, stainless steel, atitanium alloy, and a composite plastic.
 15. The method of claim 11,wherein the first insert is replaceable.
 16. The method of claim 11,further comprising: disposing a second insert on the surface of themechanical operator, wherein the second insert operates to capture theforeign material in the encapsulant compound.
 17. The method of claim11, wherein the mechanical operator is characterized as a kneader, andwherein the method further comprises: installing a kneader cam on arotator shaft, the kneader cam including the first insert disposed on akneading surface of the kneading cam; and rotating the rotator shaft tooperate the kneader cam to knead the encapsulant compound, wherein, whenthe rotator shaft is rotated, the first insert operates to captureforeign material in the encapsulant compound.
 18. The method of claim11, wherein the mechanical operator is characterized as a pelletvibrator for cleaning encapsulant compound pellets, the method furthercomprising: processing the encapsulant compound pellets in a pelletbuffer bowl of the pellet vibrator, the pellet buffer bowl including thefirst insert disposed on a surface of the pellet buffer bowl; andvibrating the pellet buffer bowl, wherein, when the pellet buffer bowlis vibrated, the first insert operates to capture foreign material mixedwith the encapsulant compound pellets.
 19. The method of claim 11,wherein the mechanical operator is characterized as an encapsulantextruder for extruding the encapsulant compound onto an electronicdevice, the method comprising: placing the first insert into a reservoirof the encapsulant extruder; placing encapsulant compound pellets intothe reservoir of the encapsulant extruder atop the first insert; meltingthe encapsulant compound pellets; and extruding the melted encapsulantcompound onto the electronic device.
 20. The method of claim 11, whereinthe mechanical operator is characterized as an encapsulant extruder forextruding encapsulant compound onto an electronic device, the methodcomprising: placing encapsulant compound pellets into a reservoir of theencapsulant extruder; placing the first insert atop the encapsulantcompound pellets; melting the encapsulant compound pellets; extrudingthe melted encapsulant compound onto the electronic device; andfiltering the melted encapsulant compound through the first insert. 21.A method of processing encapsulant compound, the method comprising:processing encapsulant compound with a mechanical operator characterizedas a kneader, the kneader including a kneader cam on a rotator shaft,the kneader cam including the first insert disposed on a kneadingsurface of the kneading cam; and wherein the first insert operates tocapture foreign material from the encapsulant compound.
 22. The methodof claim 21, wherein the first insert is a coil magnet placed within ahole in the surface of the mechanical operator.
 23. The method of claim11, wherein the first insert is a rigid magnet pressed into a hole inthe surface of the mechanical operator.
 24. The method of claim 11,wherein the insert first is fabricated of one of zinc, stainless steel,a titanium alloy, and a composite plastic.
 25. The method of claim 11,wherein the first insert is replaceable.
 26. The method of claim 11,further comprising: disposing a second insert on the surface of themechanical operator, wherein the second insert operates to capture theforeign material in the encapsulant compound.
 27. The method of claim11, wherein the method further comprises: rotating the rotator shaft tooperate the kneader cam to knead the encapsulant compound, wherein, whenthe rotator shaft is rotated, the first insert operates to captureforeign material in the encapsulant compound.
 28. The method of claim11, wherein the mechanical operator is characterized as a pelletvibrator for cleaning encapsulant compound pellets, the method furthercomprising: processing the encapsulant compound pellets in a pelletbuffer bowl of the pellet vibrator, the pellet buffer bowl including thefirst insert disposed on a surface of the pellet buffer bowl; andvibrating the pellet buffer bowl, wherein, when the pellet buffer bowlis vibrated, the first insert operates to capture foreign material mixedwith the encapsulant compound pellets.
 29. The method of claim 11,wherein the mechanical operator is characterized as an encapsulantextruder for extruding the encapsulant compound onto an electronicdevice, the method comprising: placing the first insert into a reservoirof the encapsulant extruder; placing encapsulant compound pellets intothe reservoir of the encapsulant extruder atop the first insert; meltingthe encapsulant compound pellets; and extruding the melted encapsulantcompound onto the electronic device.
 30. The method of claim 11, whereinthe mechanical operator is characterized as an encapsulant extruder forextruding encapsulant compound onto an electronic device, the methodcomprising: placing encapsulant compound pellets into a reservoir of theencapsulant extruder; placing the first insert atop the encapsulantcompound pellets; melting the encapsulant compound pellets; extrudingthe melted encapsulant compound onto the electronic device; andfiltering the melted encapsulant compound through the first insert.